Fortifying electronic interconnects against mechanical damage is the job of underfill encapsulant materials. Without them, the thermal stress from processing or damage from shock, drop, or vibration could lead to electrical failure.
Browse our portfolio of underfill materials and discover which materials may be appropriate for your application.
Underfills are epoxy-based encapsulants that bolster electrical interconnects against mechanical failure, increasing the reliability of advanced semiconductor packages and components connected to PCBs. Underfills can be applied by capillary force to the entire interconnect array, on the edges, or on the corners of the component or chip underside.
Underfills enhance the reliability of interconnects by protecting them against thermal and mechanical stress, or from moisture. The coefficient of thermal expansion (CTE) differences between substrates, components, and die may cause stress that can break or damage electrical connections. Underfills provide interconnect reinforcement and prevent damaging warpage or movement.
Prevent mechanical failure during thermal cycling
Enable 2.5D and 3D advanced semiconductor packages
Ensure reliability of large surface area BGA and CSP packages
Henkel formulations offer the highest reliability and are available in reworkable and non-reworkable options suitable for multiple applications and operating conditions. Processability considerations such as flow rate, cure mechanisms, and manufacturing throughput objectives should be weighed alongside performance requirements and application environments to choose the optimal underfill solution.
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