Encapsulants
Epoxy encapsulant for fine pitch wires and deep cavities
This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ECCOBOND FP4470 is a high-purity epoxy encapsulant with excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. It can withstand solder reflow after being exposed to JEDEC Level 2A (60°C [140°F] / 60% RH, 120 hours) preconditioning, being a high-adhesion version of LOCTITE ECCOBOND FP4450 for 260°C (500°F) L3 JEDEC performance.
-
High purity
-
260°C (500°F) reflow capability for Pb-free applications
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Excellent flow properties
- Product category:
- Encapsulants
Technologies:
-
Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 65.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 18.0 ppm/°C
- Color:
- Black
- Cure schedule, Alternate, @ 165.0 °C:
- 90.0 min.
- Cure schedule, Recommended, @ 125.0 °C:
- 30.0 min.
- Cure type:
- Heat cure
- Dielectric constant, @ 1kHz:
- 3.5
- Glass transition temperature (Tg):
- 148.0 °C
- Operating temperature:
- -65.0 °C - 150.0 °C
- Specific gravity, @ 25.0 °C:
- 1.8
- Viscosity, Brookfield - RVF, @ 25.0 °C:
- 42000.0 mPa·s (cP)
- Volume resistivity:
- 5x10¹⁶ Ohm cm
