Products

Fast setting, versatile, low-temperature hot melt for end-of-line packaging

Easily moldable hotmelt for fragile components and outdoor applications

Non-conductive adhesive for high-throughput smart cards

Black, multipurpose, high heat-resistant structural bonder and sealant

Amber polyamide hot melt for general assembly applications

Epoxy encapsulant for fine pitch wires and deep cavities 

Electrically conductive die-attach adhesive for automatic dispensing operations

Transparent liquid activator for LOCTITE toughened acrylic adhesives

Electrically-conductive die-attach adhesive for copper surfaces

Non-conductive adhesive for high-throughput die attach applications

Conductive die-attach adhesive compatible with many advanced substrates

Multi-purpose, high-strength adhesive tape for emergency body repairs