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      Material solutions for cloud/hyperscale data centre switches, routers and servers

      Find out about our latest solutions for cloud/hyperscale data centre switches, routers and servers.
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      This is the cover image of material solutions for cloud/hyperscale data center switches, routers and servers

      Consumer demand for high-speed network access, cloud storage and advanced analytics is driving the need for robust data centre solutions. Data centre interconnect (DCI) and 400GE technology are enhancing data switching and routing performance. To meet these demands, Henkel provides cutting-edge adhesives, coatings and sealants that ensure the reliability and longevity of high-performance computing components in cloud/hyperscale data centres.

      Key insights
      • Explore Henkel's diverse TIMs, including pads, films, liquids and gels, to enhance thermal management and reliability in high-power density line cards and computing servers.
      • Discover how LOCTITE® underfills enhance reliability and protect fine-pitch array components in high-performance computing and data processing ASICs.

      Related products
      • A packshot of LOCTITE SI 5421 in 2 different sizes showing 50 ml and 6 oz semco cartridges.

        Electrically conductive adhesives

        LOCTITE® SI 5421

        Flexible and shielding electrically conductive sealant and adhesive
      • A packshot of LOCTITE ABLESTIK QMI536NB in 3 different sizes showing 3CC, 5CC and 10CC syringes.

        Electrically non-conductive adhesives

        LOCTITE® ABLESTIK QMI536NB

        General purpose non-conductive adhesive for stacked die applications​
      • A packshot of LOCTITE ABLESTIK JM7000 in 3 different sizes showing 3CC, 5CC, 10CC syringes.

        Die attach adhesives

        LOCTITE® ABLESTIK JM 7000

        Electrically conductive adhesive for high-throughput die-attach applications
      • A packshot of LOCTITE ABLESTIK ABP 8068TB in 4 different sizes showing 3CC, 5CC, 10CC, and 30CC syringes.

        Electrically conductive adhesives

        LOCTITE® ABLESTIK ABP 8068TB

        High-performance adhesive with superior thermal and electrical conductivity
      • A packshot of LOCTITE ABLESTIK 8484-1LMISR4 in 4 different sizes showing 3CC, 5CC, 10CC, and 30CC syringes.

        Die attach adhesives

        LOCTITE® ABLESTIK 84-1LMISR4

        Rigid, electrically conductive die-attach adhesive for small components
      • A packshot of LOCTITE ABLESTIK 2030SC in 4 different sizes showing 3CC, 5CC, 10CC, and 30CC syringes.

        Electrically conductive adhesives

        LOCTITE® ABLESTIK 2030SC

        General purpose electrically conductive adhesive for high-speed dispensing
      • A packshot of LOCTITE 315 showing a blue 25ML syringe and a blue 300ML semco cartridge.

        Thermally conductive adhesives

        LOCTITE® 315

        Self-shimming, thermally conductive, controlled-strength activator-cured paste
      • A packshot of BERGQUIST LIQUI BOND TLB SA3500 showing brown and light grey 50CC, 200CC, and 400CC kits.

        Thermally conductive adhesives

        BERGQUIST® LIQUI BOND TLB SA3500

        Dispensable liquid for structural component bonding - extreme environments
      • A packshot of BERGQUIST GAP FILLER TGF 3500LVO showing blue and white 50CC, 200CC, and 400CC kits.

        Thermal gap fillers

        BERGQUIST® GAP FILLER TGF 3500LVO

        High-performance dispensable liquid with low outgassing

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