Thermal SIL PAD Materials
Electrically conductive, aluminum foil reinforced pad - maximum heat transfer
Thermally conductive, aluminum foil coated pad for applications where maximum heat transfer is needed but electrical isolation is not required. Low thermal impedance.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® SIL PAD TSP Q2500 is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad rubber. The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required. It is an ideal thermal interface material to replace messy thermal grease compounds - eliminating problems associated with grease, such as contamination of reflow solder or cleaning operations. Unlike grease, BERGQUIST SIL PAD TSP Q2500 can be used prior to these operations. It also eliminates dust collection, which can cause possible surface shorting or heat buildup.
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Thermal impedance: 0.22°C-in2/W (@50 psi)
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Maximum heat transfer
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Designed to replace thermal grease
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Aluminum foil coated both sides
- Product category:
- Thermal SIL PAD Materials
Technologies:
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Thermal management, sil pads
- Color:
- Pink
- Operating temperature:
- -60.0 °C - 180.0 °C
- Thermal conductivity:
- 1.2 W/mK
FAQ
Each application has specific characteristics (e.g., surface finish, flatness tolerances, high pressure requirements, potential burrs, etc.) that determine which SIL PAD product will optimize thermal performance. Select a minimum of two pads that best fit the application, then conduct testing to determine which material performs the best.
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