Part no. (SKU/IDH):
2167663
IDH Name:
BERGQUIST® SIL PAD® TSP K900
Thermal SIL PAD Materials
Electrically insulating, polyimide-reinforced pad - cost effective
This thermally conductive, polyimide-reinforced insulator pad is designed for excellent voltage breakdown and dielectric strength. Very durable, low thermal impedance.
Part no. (SKU/IDH):
2167663
IDH Name:
BERGQUIST® SIL PAD® TSP K900
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® SIL PAD® TSP K900 is a silicone-Kapton® reinforced insulator. This product combines the thermal transfer properties of Sil-Pad® with high dielectric strength and physically tough Kapton®. It is a highly durable product, able to withstand high voltages.
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Thermal impedance: 0.48°C (32.8°F) -in2/W (@50 psi)
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Withstands high voltages
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High dielectric strength
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Very durable
- Product category:
- Thermal SIL PAD Materials
Technologies:
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Silicone pads [SIL PAD]
- Dielectric breakdown voltage:
- 6000.0 Vac
- Dielectric constant, @ 1kHz:
- 5.0
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 180.0 °C
- Shore hardness, ASTM D2240, Shore A:
- 90.0
- Standard thickness:
- 0.152 mm
- Thermal conductivity:
- 0.9 W/mK
- Thermal impedance, ASTM D5470, @ 50 psi:
- 0.48 °C-in²/W
- Volume resistivity:
- 1×10 Ohm m
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