Thermal gels
High-performance thermal interface gel for telecom market applications
This 1-part, red, silicone-based, fully-cured thermal interface gel is designed for high power industrial infrastructure electronics systems.
Marketing materials
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® LIQUI FORM TLF 10000 is a thermally conductive, dispensable, highly conformable gel thermal interface material designed to meet the demanding requirements of datacom, telecom, and industrial automation applications. Its unique formulation delivers a balanced mix of high thermal conductivity, dispensing efficiency, and high reliability. This material is designed to provide efficient heat transfer between high-power electronic components and heat sinks. Recognized for its importance in optimizing electronics performance, this high thermal conductivity gel has won several industry awards.
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Dispensable pre-cured: requires no mixing or refrigeration
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Excellent thermal cycling performance and dispense properties
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Thermal conductivity: 10 W/m-K, ASTM D5470
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Low thermal impedance at thin and thick gaps
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Low compression set to reduce stress on components
- Product category:
- Thermal gels
Technologies:
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Thermal management, ultra high viscosity liquids
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 200.0 °C
- Shelf life, @ 0.0 °C:
- 180.0 day
- Thermal conductivity:
- 10.0 W/mK
