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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Thermal GAP PAD Materials

BERGQUIST® GAP PAD® TGP EMI1000

High-conformable gap pad combining thermal dissipation and EMI absorption

This thermally conductive, silicone-based, fiberglass reinforced, highly conformable gap pad filler provides EMI attenuation at frequencies of 1GHz and higher.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Information

BERGQUIST® GAP PAD TGP EMI1000 is a highly conformable, fiberglass reinforced, combination gap filling material. It offers both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing electromagnetic interference) at frequencies of 1GHz and higher. You can expect EMI attenuation and 1.0 W/m-K thermal conductivity performance with low assembly stress, and the soft nature of the material enhances wet-out at the interface, resulting in better thermal performance than harder materials with a similar performance rating. It has an inherent, natural tack on one side of the material for improved handling and no more thermally-impeding adhesive layers. The other side is tack-free, enhancing handling and rework when you need it. It’s supplied with a protective liner on the material’s tacky side. 

  • Product category:
  • Thermal GAP PAD Materials

Technologies:

  • Color:
  • Black

 

  • Density:
  • 2.4 g/cm³

 

  • Dielectric breakdown voltage:
  • 1700.0 Vac

 

  • Dielectric constant, @ 1kHz:
  • 6.0

 

  • Flame rating:
  • V-0

 

  • Heat capacity, ASTM E1269:
  • 1.3 J/g-K

 

  • Operating temperature:
  • -60.0 °C - 200.0 °C

 

  • Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:
  • 5.0

 

  • Standard thickness:
  • 0.508 mm - 3.175 mm

 

  • Thermal conductivity:
  • 1.0 W/mK

 

  • Volume resistivity:
  • 1×10 Ohm m

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

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