Part no. (SKU/IDH):
2590969
IDH Name:
BERGQUIST GAP PAD TGP 800VOS
Thermal GAP PAD Materials
Silicone, thermally conductive soft gap pad for diverse applications
This silicone, thermally conductive gap pad has high conformability and is ideal for a wide range of applications.
Part no. (SKU/IDH):
2590969
IDH Name:
BERGQUIST GAP PAD TGP 800VOS
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
- {{^distributor.unique}} {{/distributor.unique}} {{/distributor.isExpanded}} {{^distributor.isExpanded}} {{/distributor.isExpanded}} {{/distributor.isVisible}} {{/data}}
- Description
- Technical specification
BERGQUIST® GAP PAD TGP 800VOS is a silicone, thermally conductive, highly conformable gap pad offering enhanced resistance against puncture, shear, and tear. It is electrically isolating and recommended for applications that require minimum pressure on components. It is ideal for use between any heat source and heat sink in telecommunications, computers, and power conversion.
-
Highly conformable
-
Thermal conductivity: 0.8 W/m-K
-
Reworkable
-
Low outgassing
- Product category:
- Thermal GAP PAD Materials
Technologies:
-
Thermal management, gap pads
-
Thermal management, circuits and substrates
-
Thermal management, silicone pads
- Density:
- 1.6 g/cm³
- Dielectric breakdown voltage:
- 6000.0 Vac
- Dielectric constant, @ 1kHz:
- 5.5
- Flame rating:
- V-0
- Heat capacity, ASTM E1269:
- 1.0 J/g-K
- Operating temperature:
- -60.0 °C - 200.0 °C
- Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:
- 25.0
- Standard thickness:
- 0.508 mm - 5.08 mm
- Thermal conductivity:
- 0.8 W/mK
- Volume resistivity:
- 1×10 Ohm m
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
- {{^distributor.unique}} {{/distributor.unique}} {{/distributor.isExpanded}} {{^distributor.isExpanded}} {{/distributor.isExpanded}} {{/distributor.isVisible}} {{/data}}