Hot melt adhesives
Hot melt adhesive for low-pressure moulding applications and fragile components
A 1-part, solvent-free, low-viscosity hot melt adhesive perfect for moulding applications and encapsulation of fragile components without damage, and is specially designed to meet low-pressure moulding process requirements.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
TECHNOMELT® PA678 BLACK is a high-performance thermoplastic polyamide, specially designed to meet low-pressure moulding process requirements. Its low viscosity allows encapsulation of fragile components without damage, and you can expect a good balance of low and high temperature performance. It has excellent environmental resistance and good adhesion to a variety of substrates.
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Solvent-free
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Easy mouldability
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Good adhesion to a variety of substrates
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Excellent environmental resistance
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Very short open time
- Product category:
- Hot melt adhesives
Technologies:
-
Hot Melts, polyamide
- Color:
- Black
- Density:
- 0.98 g/cm³
- Melt viscosity, RVT, ASTM D 3236, @ 210.0 °C:
- 2500.0 mPa·s - 4000.0 mPa·s
- Softening point temperature:
- 185.0 °C
