Electrically non-conductive adhesives
General purpose non-conductive adhesive for stacked die applications
Semi-flexible hybrid-based electrically non-conductive adhesive. Perfect for insulating die attach applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Rating & reviews
- Question & answer
For stacked die applications requiring very low stress and robust mechanical properties, LOCTITE® ABLESTIK QMI536NB is ideal. This low bleed, non-electrically conductive PTFE-filled paste has fast cure, high temperature stability and great reliability on a wide variety of surfaces, including solder resist, flexible tape, bare silicon, and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning, even after multiple exposures to lead-free solder reflow temperatures.
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Electrically insulating
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Stacked die application
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Low bleed
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PTFE-filled paste for high temperature stability
- Product category:
- Electrically non-conductive adhesives
- Technologies:
- Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 80.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 150.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 19.0 ppm
- Extractable ionic content, Fluoride (F-):
- 19.0 ppm
- Extractable ionic content, Potassium (K+):
- 19.0 ppm
- Extractable ionic content, Sodium (Na+):
- 19.0 ppm
- Glass transition temperature (Tg):
- -30.0 °C
- Hot die shear strength:
- 15.0 kg-f
- Recommended for use with:
- Laminate,Polyimide
- Thixotropic index:
- 5.0
- Viscosity:
- 10000.0 mPa·s (cP)
