Electrically conductive adhesives
Electrically conductive adhesive with a low-temperature cure
Electrically conductive epoxy adhesive for stable contact resistance and a low-temperature cure. Offers a more secure electrical interconnection than traditional soldering.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK CE 3103WLV is a great lead-free alternative to solder, has stable contact resistance on non-noble terminated (Sn, SnPb, Ni, etc) components and substrates, and passes NASA outgassing standards, making it a great adhesive for all types of component assembly.
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Electrically conductive
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Low cure temperature
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Pb-free alternative to solder
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Stable contact resistance
- Product category:
- Electrically conductive adhesives
Technologies:
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Thermosets, electronics assembly materials
- Application method:
- Dispense gun
- Cure schedule, @ 120.0 °C:
- 10.0 min.
- Cure type:
- Heat cure
- Number of components:
- 1 part
- Operating temperature:
- 150.0 °C
- Physical form:
- Paste
- Recommended for use with:
- Metal: tin
- Shear strength:
- 1890.0 psi
- Storage temperature:
- -40.0 °C - -35.0 °C
- Thixotropic index:
- 5.5
- Viscosity, Plate 2 cm, @ 25.0 °C:
- 20000.0 mPa·s (cP)
- Volume resistivity:
- 0.0008 Ohm cm
