Electrically non-conductive adhesives
Non-conductive adhesive for cap and lid attach applications
This non-conductive die-attach adhesive is designed for cap and lid attach applications in wire bond packages.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK ABP 8420 is a non-conductive epoxy adhesive for cap and lid attach applications in wire bond packages. It’s typically used for optical sensors, lenses and 3D modules. It’s jettable with minimal resin bleed-out (RBO) and minimal adhesion drop post-reliability. A bondline thickness of >1 mm (0.04") must be maintained if used over an active die face to prevent die scarring. It cures fast when exposed to direct heat energy or hot-plate techniques. In conventional box or convection oven curing, it will cure at temperatures as low as 80ºC (176ºF).
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Fast curing
-
Jettable
-
Non-conductive
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Excellent resin bleed-out performance
- Product category:
- Electrically non-conductive adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 54.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 154.0 ppm/°C
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 75.0 °C
- Thermal conductivity:
- 0.3 W/mK
- Thixotropic index:
- 5.8
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 13500.0 mPa·s (cP)
