Die attach adhesives
Non-conductive, silicone, die attach adhesive
This silicone, low modulus, non-conductive die attach adhesive is designed for MEMs package applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK ABP 8142B3 is a non-conductive die attach adhesive specially designed for MEMs package applications. It is low modulus and has black pigmentation for blocking light.
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Black pigmentation for blocking light
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Low modulus
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Non-conductive
- Product category:
- Die attach adhesives
- Applications:
- Die attach
- Cure type:
- Snap cure
- Thixotropic index:
- 3.3
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 12254.0 mPa·s (cP)
