Electrically conductive adhesives
High performance adhesive with superior thermal and electrical conductivity
This rigid, semi-sintering die attach adhesive is ideal for semiconductor packages requiring excellent thermal and electrical conductivity.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
If you need a superior semi-sintering die attach adhesive for high end power packages, choose LOCTITE® ABLESTIK ABP 8068TB. It provides high adhesion, low stress, and enhanced resin bleed control. Thermal performance is comparable to that of a solder paste product, and you can expect great sintering properties on gold, silver, copper, and PPF substrates.
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No resin bleed-out
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One component
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Good workability
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Good sintering properties when used on Ag, PPF, Au and Cu substrates
- Product category:
- Electrically conductive adhesives
Technologies:
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Thermosets, electronics semiconductor materials
- Coefficient of thermal expansion (CTE):
- 25.0 ppm/°C
- Cure type:
- Heat cure
- Thixotropic index:
- 5.5
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 11500.0 mPa·s (cP)
