Electrically non-conductive adhesives
Non-conductive die-attach adhesive for array packaging
This red, non-conductive die-attach adhesive is designed for flex, laminate and die-to-die.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK 2053S is a polymer-filled, hybrid, non-conductive die-attach adhesive for array packaging. It's typically used for the ASIC (Application Specific Integrated Circuit) attach of automotive optical sensors, and as a receiver and die-attach for 3D sensing modules. It's proven effective on various substrates, such as EMC, engineering plastic, glass and metals, and offers low warpage, stress and moisture uptake. It s a low-modulus adhesive, making it ideal for wire bonding small die sizes and chip bonding on FR4 substrates. It cures when exposed to heat.
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Low-stress
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Non-conductive
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Low moisture uptake
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Multi-substrate
- Product category:
- Die attach adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 149.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 216.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 9.0 ppm
- Extractable ionic content, Potassium (K+):
- 9.0 ppm
- Extractable ionic content, Sodium (Na+):
- 9.0 ppm
- Glass transition temperature (Tg):
- -21.0 °C
- Hot die shear strength:
- 2.1 kg-f
- RT die shear strength:
- 6.0 kg-f
- Tensile modulus, @ 250.0 °C:
- 22.0 N/mm² (3200.0 psi)
- Thixotropic index:
- 2.5
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 130000.0 mPa·s (cP)
