Electrically non-conductive adhesives
Non-conductive die-attach adhesive for array packaging
A red non-conductive die-attach adhesive for flex, laminate and die-to-die.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
A LOCTITE® ABLESTIK 2053S is a polymer-filled, hybrid, non-conductive die-attach adhesive for array packaging. It's typically used for the ASIC (Application Specific Integrated Circuit) attach of automotive optical sensors, as a receiver and die-attach for 3D sensing modules. It's proven effective on various substrates, such as EMC, engineering plastic, glass and metals, and offers low warpage, stress and moisture uptake. LOCTITE ABLESTIK 2053S is a low-modulus adhesive, making it ideal for wire bonding small die sizes and chip bonding on FR4 substrates. It cures when exposed to heat.
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Low-stress
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Non-conductive
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Low moisture uptake
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Multi-substrate
- Product category:
- Die attach adhesives
Technologies:
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Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 149.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 216.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 9.0 ppm
- Extractable ionic content, Potassium (K+):
- 9.0 ppm
- Extractable ionic content, Sodium (Na+):
- 9.0 ppm
- Glass transition temperature (Tg):
- -21.0 °C
- Hot die shear strength:
- 2.1 kg-f
- RT die shear strength:
- 6.0 kg-f
- Tensile modulus, @ 250.0 °C:
- 22.0 N/mm² (3200.0 psi)
- Thixotropic index:
- 2.5
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 130000.0 mPa·s (cP)
