Electrically conductive adhesives
General purpose electrically conductive adhesive for high-speed dispensing
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
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Snap curable for quick handling
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Low stress bonding
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1-part: no mixing required
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Suitable for variety of package sizes
- Product category:
- Electrically conductive adhesives
Technologies:
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Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 19.0 ppm
- Extractable ionic content, Potassium (K+):
- 4.0 ppm
- Extractable ionic content, Sodium (Na+):
- 29.0 ppm
- Hot die shear strength:
- 0.96 kg-f
- RT die shear strength, 2 x 2 mm Si die on Pd:
- 1.9 kg-f
- Tensile modulus, @ 250.0 °C:
- 450.0 N/mm² (65000.0 psi)
- Thixotropic index:
- 4.6
