Encapsulants
UV-resistant hot melt adhesive for low-pressure molding
This 1-part, low viscosity, UV-resistant thermoplastic hot melt adhesive is specially designed for molding compound applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
TECHNOMELT® PA 6344 is a low viscosity, 1-part hot melt adhesive specially designed to meet low-pressure molding process requirements: you can expect reliable encapsulation of fragile components without damage. Once applied, it solidifies to form a barrier between electronics and the environment (it’s designed for use in exterior applications needing UV stability). It has good heat stability and moisture resistance, and is ideal for potting electronics modules, molding strain relief into wiring, and encapsulation of sensors. It is a versatile adhesive, which works well on many substrates, including FR4, metals and many plastics including ABS and PC. It has an operating temperature range of 0°C to 100°C (32°F to 212°F).
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Adheres well to a variety of substrates
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UV and moisture resistant
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Low viscosity
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Good heat stability
- Product category:
- Encapsulants
Technologies:
-
Hot Melts, polyamide
- Color:
- Black
- Elongation, at break:
- 700.0 %
- Operating temperature:
- -40.0 °C - 100.0 °C
- Recommended for use with:
- Glass
- Shore hardness, Shore A:
- 76.0
- Softening point temperature:
- 147.0 °C
- Viscosity, @ 225.0 °C:
- 7000.0 mPa·s (cP)
