Potting compounds
One-part, heat-curing epoxy potting compound
One-part, black epoxy compound for effective potting and encapsulation of electronic circuits.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
If you’re looking for effective environmental and thermal protection of critical electronic components, give LOCTITE® STYCAST EO 1058 a try. This epoxy-based potting compound cures at 257°F (125°C) and is especially suited for use in protecting sensors used in harsh environments such as automotive applications.
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Based on high-strength epoxy
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Designed to operate in harsh environments
- Product category:
- Potting compounds
Technologies:
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Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Below Tg:
- 24.0 ppm/°C
