Encapsulants
Liquid epoxy underfill encapsulant for a rigid, low-stress seal
This liquid epoxy underfill encapsulant is specially formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is specially designed to improve crack/fracture resistance and deliver faster flow. When fully cured, it forms a rigid, low-stress seal that dissipates stress in solder joints and extends thermal cycling performance.
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Improved toughness
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Low CTE
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High purity
- Product category:
- Encapsulants
- Coefficient of thermal expansion (CTE), Above Tg:
- 100.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 25.0 ppm/°C
- Glass transition temperature (Tg):
- 118.0 °C
- Storage modulus, DMA, @ 25.0 °C:
- 11500.0 N/mm² (1667934.0 psi)
- Storage temperature:
- -40.0 °C
- Viscosity, Brookfield, @ 25.0 °C:
- 22120.0 mPa·s (cP)
