Encapsulants
High purity encapsulant for a rigid sealing flip-chip BGAs
This epoxy-based, gray, high-purity underfill encapsulant is designed for tight bump pitches and narrow gaps in flip-chip BGA applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ECCOBOND UF 8830S is a gray, high-purity underfill encapsulant. It’s typically used for tight bump pitches and narrow gaps in flip-chip BGA applications, improving crack/fracture resistance and delivering faster flow. It exhibits a long staging time and work life and is proven stable at 260°C (500°F) reflow for Pb-free, low-k applications. LOCTITE® ECCOBOND UF 8830S is formulated with an epoxy-based resin and cures when exposed to heat. When fully cured, it forms a rigid, low-stress seal that dissipates stress in solder joints and extends thermal cycling performance.
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Good flow with self-filleting
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High purity
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High TG
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Low CTE
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Improved toughness
- Product category:
- Encapsulants
Technologies:
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Thermosets, electronics semiconductor materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 100.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 25.0 ppm/°C
- Glass transition temperature (Tg):
- 118.0 °C
- Storage modulus, DMA, @ 25.0 °C:
- 11500.0 N/mm² (1667934.0 psi)
- Storage temperature:
- -40.0 °C
- Viscosity, Brookfield, @ 25.0 °C:
- 22120.0 mPa·s (cP)
