Underfills
Halogen-free, low-viscosity reworkable underfill
This reworkable, low-viscosity underfill encapsulant is specially formulated to flow at room temperature: no additional preheating required.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ECCOBOND UF 3811 is a halogen-free, reworkable, low-viscosity epoxy underfill specially designed for Ball Grid Array (BGA) and Chip Scale Packaging (CSP) applications. It flows at room temperature with no additional preheating required, and cures quickly at moderate temperatures to minimize stress to other components. When cured, it has a high glass transition temperature while maintaining flexibility, so solder joints are protected during thermal cycling and drop testing.
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Room temperature flow
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Low viscosity
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High glass transition temperature (Tg)
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Fast cure at moderate temperatures
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No preheating required
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 190.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 61.0 ppm/°C
- Cure schedule, @ 100.0 °C:
- 60.0 min.
- Glass transition temperature (Tg):
- 124.0 °C
- Viscosity, Brookfield, Physica, @ 25.0 °C:
- 354.0 mPa·s (cP)
