Underfills
Low-viscosity epoxy underfill for capillary flow on flip chip applications
This low viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip-chip applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ECCOBOND FP4526 is a heat-curable 63% filled underfill designed for capillary flow on flip chip applications. Its fast flow and low viscosity, along with its excellent wettability and adhesion, make it ideal for high reliability applications. It can be used on ceramic, organic, solder mask and polyimide substrates, but is perfect for ceramic packages and FC on flex applications.
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Excellent wettability
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Excellent adhesion
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Low viscosity
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Fast flow
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 101.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 33.0 ppm/°C
- Cure schedule, @ 165.0 °C:
- 15.0 min.
- Flexural modulus:
- 8500.0 N/mm² (1232500.0 psi)
- Glass transition temperature (Tg):
- 133.0 °C
- Viscosity, Brookfield Cone & Plate, @ 25.0 °C:
- 4700.0 mPa·s (cP)
