Underfills
One-part, capillary-flow epoxy underfill for high volume operations
Fast-flowing and void-free epoxy underfill with excellent adhesion and strength for high-volume assembly operations.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
If you’re looking for an underfill that can handle high-volume assembly operations where fast-flow filling is required, LOCTITE® ECCOBOND E 1216M™ is a great pick. Our ECCOBOND E 1216M™ composite cures entirely in a single reflow cycle but is stable enough to be easily shipped and used in large-volume cartridges (up to 20oz). This black, epoxy-based underfill is ideal for those who prefer to work with anhydride-free products, as it’s specifically formulated to eliminate anhydride-type curing agents.
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Void-free
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Retains stability during shipping, storage, and use
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Snap-curing
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High glass transition temperature (Tg)
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 131.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 35.0 ppm/°C
- Glass transition temperature (Tg):
- 125.0 °C
- Viscosity, Brookfield, Spindle 4, speed 20 rpm:
- 4000.0 mPa·s (cP)
- Work life:
- 5.0 day
