Thermal SIL PAD Materials
Electrically insulating pad - high performance
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® SIL PAD® TSP 3500 is a thermally conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease-free and reinforced with fiberglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics.
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Thermal impedance: 0.33°C (32.6°F) -in2/W at 50 psi
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High thermal conductivity 3.5 W/m-K
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Optimal heat transfer
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Easy to use and rework
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Thermal SIL PAD Materials
Technologies:
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Thermal management, circuits and substrates
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Thermal management, sil pads
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Specialties, others
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Thermal management, silicone pads
- Carrier type:
- Fiberglass
- Color:
- White
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 200.0 °C
- Standard thickness:
- 0.254 mm - 0.508 mm
- Thermal conductivity:
- 3.5 W/mK
FAQ
BERGQUIST® SIL PAD TSP A3000 uses a different filler package than BERGQUIST® SIL PAD® TSP 3500. This change results in a more compliant BERGQUIST® SIL PAD TSP A3000 material that inherently lowers interfacial resistance losses. This reduction in interfacial resistance results in improved overall thermal performance when measured at lower pressures in standard ASTM D5470 and TO-220 testing
The answer is based on the assumption that the primary design intent is to increase thermal performance. If your application uses lower clamping pressures (e.g., 10 to 75 psi), you will find BERGQUIST® SIL PAD TSP A3000 to provide excellent thermal performance. In contrast, if you are designing for higher clamping pressures (e.g., 100 psi or greater), it is likely that you will require the thermal performance characteristics of BERGQUIST® SIL PAD TSP 3500.
Yes. Henkel evaluates and publishes voltage breakdown, dielectric constant and volume resistivity data per ASTM standards for these materials. Due to differences between ASTM lab testing and actual application performance, for best results, these characteristics should be evaluated within the actual customer system.
Each application has specific characteristics (e.g., surface finish, flatness tolerances, high pressure requirements, potential burrs, etc.) that determine which SIL PAD product will optimize thermal performance. Select a minimum of two pads that best fit the application, then conduct testing to determine which material performs the best.
The ISO certification is the adoption of a quality management system that is a strategic decision of the organization. This International Standard specifies requirements for a quality management system where an organization: a) needs to demonstrate its ability to consistently provide product that meets customer and applicable regulatory requirements, and b) aims to enhance customer satisfaction through the effective application of the system, including processes for continual improvement of the system and the assurance of conformity to customer and regulatory requirements.
