Thermally conductive adhesives
Dispensable liquid for structural component bonding - extreme environments
This 2-part, liquid silicone adhesive is designed to offer high bond strength and thermal conductivity in extreme environments.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® LIQUI BOND TLB SA3500 is a thermally conductive, high-performance adhesive material that, after mixing, begins to cure at room temperature and can be accelerated with heat. Once cured, this product maintains an excellent structural bond, which can withstand severe environmental conditions and eliminates the need for mechanical fasteners. The mild elastic properties of the product assist in relieving coefficient of thermal expansion (CTE) stresses during thermal cycling.
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Eliminates need for mechanical fasteners
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Thermal conductivity: 3.5 W/m-K
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Maintains structural bond in severe-environment applications
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Room temperature storage
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Thermally conductive adhesives
Technologies:
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Thermal management, speciality liquids
- Cure type:
- Heat cure
- Operating temperature:
- -60.0 °C - 200.0 °C
- Shelf life, @ 25.0 °C:
- 6.0 mon.
- Thermal conductivity:
- 3.5 W/mK
