Electrically conductive adhesives
Electrically conductive adhesive for SMD interconnections
This 1-part, low-temperature curing, electrically conductive die-attach adhesive is designed for SMD interconnect formation and stencil/screen printing.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK ICP 3920 is a silver, electrically conductive die-attach adhesive for dispense or printing applications and surface-mount technology (SMT) assembly processes. It’s a low-viscosity, low-CTE and Pb-free alternative to solder with a long work life for minimal product waste and clean-up time. It’s formulated with an epoxy-based resin, cures fast when exposed to heat and doesn’t require any post-cure. LOCTITE ABLESTIK ICP 3920 is an improved version of ABLESTIK CE 3920 and can be used with finer dispensing needles without clogging.
-
Pb-free
-
Offers a long work life
-
No post-cure required
-
Thermosetting
-
Low viscosity and low CTE
- Product category:
- Electrically conductive adhesives
Technologies:
-
Thermosets, electronics assembly materials
- Application method:
- Dispense gun
- Cure schedule, @ 110.0 °C:
- 60.0 min.
- Cure type:
- Heat cure
- Number of components:
- 2 part
- Operating temperature:
- -45.0 °C - 150.0 °C
- Shear strength:
- 1310.0 psi
- Storage temperature:
- 0.0 °C - 8.0 °C
- Thixotropic index:
- 5.7
- Viscosity, cone & plate, Angle 3°, Speed 5 rpm:
- 26100.0 mPa·s (cP)
- Volume resistivity:
- 0.0003 Ohm cm
