Die attach adhesives
Conductive die-attach adhesive compatible with many advanced substrates
This acrylate-based and silver-filled, conductive die-attach adhesive paste is mainly used for attaching integrated circuits and components.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK ABP 8037TI is a silver, thermally and electrically conductive die-attach adhesive for attaching integrated circuits and components onto metal lead frames and advanced substrates. It's compatible with a wide array of metals and ceramic surfaces, silver-plated copper and pre-plated lead frames (NiPdAu) and exhibits high stability at high temperatures. It’s formulated with an acrylate-based resin and cures when exposed to heat.
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Multi-substrate
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Stable at high temperatures
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Hydrophobic
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Compatible with many metals and ceramic surfaces
- Product category:
- Die attach adhesives
Technologies:
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Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 62.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 10.0 ppm
- Extractable ionic content, Potassium (K+):
- 1.0 ppm
- Extractable ionic content, Sodium (Na+):
- 20.0 ppm
- Hot die shear strength:
- 7.4 kg-f
- RT die shear strength:
- 17.6 kg-f
- Young's modulus, @ 250.0 °C:
- 1300.0 N/mm² (188549.0 psi)
