Film adhesives
Film adhesive ideal for microwave circuitry and heat sink attach applications
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
For a cleaner, no-waste alternative to paste when you’re working with microwave circuitry and heat sink attach applications, LOCTITE® ABLESTIK 5025E is a great choice. This silver-filled electrically conductive thin-film adhesive offers uniform bondline control and excellent thermal and electrical conductivity. Particularly ideal for bonding hot devices onto heat sinks in large bonding area applications, this product provides RF/EMI shielding, passes NASA outgassing standards, and meets MIL-STD-883, Method 5011 requirements.
-
Thin, uniform bondline control
-
Silver filled
-
RF/EMI shielding
-
Electrically conductive in x, y and z axes
- Product category:
- Film adhesives
Technologies:
-
Thermosets, electronics assembly materials
-
Thermosets, 2K general epoxy
- Agency approvals / certificates / specifications:
- MIL standard 883 (method 5011)
- Cure schedule, @ 150.0 °C:
- 30.0 min.
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 90.0 °C
- Physical form:
- Film
- Shear strength, Aluminum:
- 2000.0 psi
- Thermal conductivity:
- 6.5 W/mK
FAQ
Yes. Assembly film is regularly cut into preform shapes to exactly match customer specifications.
Henkel utilizes 3 different methods to cut preforms, a die cutter, laser cutter and knife plotter. Each method has benefits as well as limitations. Henkel chooses the best and most appropriate method to cut a preform on a case by case basis.
Assembly film is cured by a combination of heat and pressure. Typical cure schedules are 125C / 2 hours or 150C / 30 minutes while maintaining pressure of a minimum 2-10 psi.
Simple spring clamps or weights are commonly used to apply pressure to assembly film during cure. Other more advanced methods include vacuum bagging and vacuum presses.
To maximize adhesive performance, a clean substrate is required. Industry standard cleaning methods include solvent cleaning, mechanical abrasion / cleaning or chemical treatment.
