Die attach adhesives
Electrically-conductive die-attach adhesive for copper surfaces
A silver electrically conductive adhesive for applications that require very fast cure at low temperatures.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ABLESTIK 3230 is a silver electrically conductive die-attach epoxy for high-reliability package applications of various sizes. It cures fast when exposed to heat and offers good, low-stress adhesion to copper and high JEDEC performance.
-
Improved JEDEC performance
-
Fast curing
-
Good adhesion to copper
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Low stress
- Product category:
- Electrically conductive adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 80.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 205.0 ppm/°C
- Color:
- Silver
- Cure schedule, Alternate, @ 175.0 °C:
- 55.0 min.
- Cure schedule, Recommended, @ 175.0 °C:
- 45.0 min.
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 37.0 °C
- RT die shear strength, 2 x 2 mm, Si die Ag/Cu LF:
- 15.0 kg-f
- Thixotropic index:
- 5.6
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 9500.0 mPa·s (cP)
- Volume resistivity:
- 0.05 Ohm cm
