Surface mount adhesives
Very high dispense speed, electrically non-conductive surface mount adhesive
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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1-part: no mixing required
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Very high dispense speed
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High wet strength
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Electrically non-conductive
- Product category:
- Surface mount adhesives
Technologies:
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Thermosets, electronics assembly materials
- Casson viscosity, cone & plate Haake PK100, M10/PK1, 2°, @ 25.0 °C:
- 0.5 Pa∙s - 3.0 Pa∙s
- Coefficient of thermal expansion (CTE), Above Tg:
- 100.0 ppm/°C
- Cure schedule, @ 150.0 °C:
- 90.0 sec. - 120.0 sec.
- Cure type:
- Heat cure
- Number of components:
- 1 part
- Physical form:
- Gel
- Shear strength, Steel (grit blasted):
- 2175.0 psi
- Storage temperature:
- 2.0 °C - 8.0 °C
- Yield point, cone & plate, Haake PK100, M10/PK1, 2°, @ 25.0 °C:
- 130.0 Pa∙s - 280.0 Pa∙s
