Case study
This case study looks at how low-pressure, low thermal impedance, phase-change thermal interface material provides a much-needed solution for next-gen data centre ICs.
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Data centre switches, routers and servers are incorporating larger, more powerful CPUs/GPUs to manage increasing data processing and bandwidth demands. The new semiconductor packages, many containing multiple large dies, are seeing higher power concentrations, resulting in elevated operational temperatures. At the same time, new generations of switch, router and server designs are becoming more compact, which limits the thermal material types that are effective with very thin bond lines.
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