Part no. (SKU/IDH):
2190279
IDH Name:
BERGQUIST® GAP PAD® TGP 2000
${product.sortedProductCategories1}
Thermally conductive reinforced pad for low-stress applications
This silicone-based, highly conformable, reinforced gap-filling material is recommended for low-stress applications requiring a mid- to high thermally conductive interface material.
Part no. (SKU/IDH):
2190279
IDH Name:
BERGQUIST® GAP PAD® TGP 2000
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
- Description
- Technical specification
BERGQUIST® GAP PAD® TGP 2000 is highly conformable, so the pad can fill air voids and air gaps with stepped topography, rough surfaces and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application and assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
-
Thermal conductivity: 2.0 W/m-K
-
Low thermal resistance at very low pressures
-
Designed for low-stress applications
-
Highly conformable
-
Low hardness
- Colour:
- Grey
- Density:
- 2.9 g/cm³
- Dielectric breakdown voltage:
- 5000.0 Vac
- Dielectric constant, @ 1kHz:
- 6.0
- Flame rating:
- V-0
- Heat capacity, ASTM E1269:
- 0.6 J/g-K
- Operating temperature:
- -60.0 °C - 200.0 °C
- Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:
- 30.0
- Standard thickness:
- 0.508 mm - 3.175 mm
- Thermal conductivity:
- 2.0 W/mK
- Volume resistivity:
- 1×10 Ohm m
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
Our experts are here to learn more about your needs.
Our support centre and experts are ready to help you find solutions for your business needs.