Part no. (SKU/IDH):
2195432
IDH Name:
BERGQUIST® GAP PAD® TGP 1350
Thermal GAP PAD materials
Reworkable, thermally conductive pad for fragile components
This silicone, thermally conductive and reworkable gap pad is highly conformable, easily compressible and is reinforced with a PEN film for rework and improved resistance to punctures and tears.
Part no. (SKU/IDH):
2195432
IDH Name:
BERGQUIST® GAP PAD® TGP 1350
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® GAP PAD® TGP 1350 is a silicone-based, thermally conductive gap pad for fragile components. It is conformable and compliant, and reinforced with a PEN film. This not only allows rework, but also improves resistance to punctures and tears. It’s also highly durable and UL 94 V-0 compliant.
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Easily compressible (shore OO 30)
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Highly durable
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UL94 V-0 compliant
- Product category:
- Thermal GAP PAD materials
Technologies:
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Gap pads [GAP PAD]
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2C general epoxy
- Carrier type:
- PEN film
- Colour:
- Light pink
- Operating temperature:
- -60.0 °C - 150.0 °C
- Thermal conductivity:
- 1.3 W/mK
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