Optical transceivers, switches, and components move data at the speed of light across metro, long haul, sub-sea, and data center interconnect (DCI). Optical devices demand smaller footprints, faster processing power, improved long-term reliability, and cost-effectiveness. In production, alignment and assembly precision are critical.
Optical transport networks provide high-speed data communications access for growing volumes of data. Optical interconnects must be reliable and efficient and advanced materials help improve performance.
- Article
- Infographic
- White paper
- Optical Transceiver
- Wavelength Selective Switch (WSS)
- ROADM
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.
Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.
Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.
Optical transceivers utilize laser diodes and photodiodes for high-speed data transmission over fiber optic cables. Advanced materials in optical transceivers help maintain stability, enable precise alignment, and deliver optimal light into the optical fiber, enabling high-speed data transmission.
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.
Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.
Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.
Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.
WSS helps improve telecom network availability and facilitate high-speed data transfer rates, making them a crucial part of telecom networks. These components must be precisely aligned and durably bonded for reliable long-term function.
Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.
Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.
Reconfigurable optical add-drop multiplexer (ROADM) systems are critical for telecom performance, enable effortless, flexible management of wavelengths, and monitoring of network optimization. Advanced materials must enable precise alignment, durable bonding and reliable long-term functionality.
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