Enhance thermal conductivity and boost your component performance and efficiency with highly conformable thermal GAP PAD® products.
Bergquist® GAP PAD® products are suitable for many electrical applications. Browse the full portfolio of materials to find the right product for your thermal management pad needs. From super soft to harder silicone-free options for a range of applications, find the right gap filler pads for any task with the range of Bergquist® thermal GAP PAD® materials. Explore the full range:
Thermal GAP PAD® materials are soft and highly conformable pads that eliminate air gaps, reduce interface resistance, and provide shock dampening qualities in devices. Thermal GAP PAD® materials can be found in a variety of thickness and hardness options and are available in sheets and die-cut parts. For more details on the qualities and benefits of GAP PAD® materials, please watch the video.
GAP PAD® products are soft, conformable thermal pads that provide effective thermal interfaces between heat sinks and electronic devices, accommodating for uneven surfaces, air gaps, and rough surface textures.
Henkel’s Bergquist® GAP PAD® materials are exceptionally simple to use, making them easy to bring into your processes. Our GAP PAD® products are manufactured to size and facilitate easy application. Your operators simply peel the protective film and place the thermal management pad on the desired component.
We offer GAP PAD® products in a variety of standard dimensions and thicknesses to suit a range of applications. Or, if you have specific application requirements, our thermally conductive GAP PAD® materials can be customized.
Available as custom die-cut parts with the ability to individualize thickness and construction, thermally conductive GAP PAD® materials are always fit for purpose to ensure optimized thermal control, no matter the application.
Henkel GAP PAD® products offer shock dampening abilities. This means they are recommended for use in applications that require a minimum amount of pressure between components. You can also find GAP PAD® product options in silicone-free formulations for applications that do not allow silicone, such as silicone-sensitive optic components.
The broad GAP PAD® product family provides an effective thermal interface between heat sinks and electronic devices where textures are present. GAP PAD® thermal materials also offer an extensive thermal conductivity range – going as high as 40.0 W/mK.
At Henkel, we also make sure you are getting the right GAP PAD® product for every application. Our application specialists work closely with customers to specify the proper GAP PAD® material for each unique thermal management requirement.
Reduce thermal resistance
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Eliminating air gaps to reduce thermal resistance within assemblies.
Ultra-conformable
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Offering ultra-conformable form, with minimal thermal GAP PAD® gap filler compression, low modulus reduces interfacial resistance.
Low-stress vibration dampening
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Providing low-stress vibration dampening within assemblies.
Shock absorption
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Absorbing shock to reduce the risk of damage caused by impact.
Easy handling
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Providing easy handling qualities thanks to their solid format.
Simplified application
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Offering simplified application. Just peel off the back and place it within the assembly.
Resilience in applications
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Puncture, shear, and tear resistance offers added resilience in applications.
Thermal performance for high-heat assemblies
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Improving thermal performance for high-heat assemblies.
Deciding which GAP PAD® product you need will depend on the requirements of your application and the components you are assembling. Our GAP PAD® products come in a range of options, including:
- With or without adhesive qualities for use in different types of assembly
- Rubber-coated fiberglass reinforcement for high-stress assemblies
- Thicknesses from 0.010 in. to 0.250 in. to effectively fill any gaps and reduce voids
- Silicone-free thermal GAP PAD® products are available in thicknesses of 0.010 in. to 0.125 in
- Custom die-cut parts, sheets, and rolls (converted or unconverted) to easily fit into your operations
- Custom thicknesses and constructions to suit the needs of any application
- Adhesive or natural inherent tack
- Custom, specialized GAP PAD® materials are available. Tooling charges vary depending on the tolerance and complexity of the part
GAP PAD® thermal interface products are well-suited to a wide variety of industries and applications. They are used across many types of assemblies in electronics, power conversion, telecommunication, automotive, medical, aerospace, and satellite applications, including:
- Between an IC and a heat sink or chassis; typical packages include BGAs, QFPs, SMT power components, and magnetics
- Between a semiconductor and heat sink
- Cooling for memory modules
- In DDR and SD RAM assemblies
- Cooling hard drives and computer parts
- Thermal management of power supplies
- In IGBT modules
- Signal amplifier thermal management
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