Part no. (SKU/IDH):
2168254
IDH Name:
BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge
Thermal gap fillers
High-performance dispensable liquid with low outgassing
This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low-stress assembly. It offers low volatile outgassing for silicone-sensitive applications.
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge en_GLBERGQUIST GAP FILLER TGF 3500LVO PTA known as GF3500LV-00-240 Part A (2309700)IDH: 2168254
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge en_GLBERGQUIST GAP FILLER TGF 3500LVO PTB known as GF3500LV-00-240 Part B (2309701)IDH: 2168254
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge de_CHBERGQUIST GAP FILLER TGF 3500LVO PTB known as GF3500LV-00-240 Part B (2309701)IDH: 2168254
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge en_GLBERGQUIST GAP FILLER TGF 3500LVO PTB known as GF3500LV-00-240 Part B (2309701)IDH: 2168254
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge en_GLBERGQUIST GAP FILLER TGF 3500LVO PTA known as GF3500LV-00-240 Part A (2309700)IDH: 2168254
-
BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge de_CHBERGQUIST GAP FILLER TGF 3500LVO PTA known as GF3500LV-00-240 Part A (2309700)IDH: 2168254
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge fr_CHBERGQUIST GAP FILLER TGF 3500LVO PTB known as GF3500LV-00-240 Part B (2309701)IDH: 2168254
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge fr_CHBERGQUIST GAP FILLER TGF 3500LVO PTA known as GF3500LV-00-240 Part A (2309700)IDH: 2168254
Part no. (SKU/IDH):
2168254
IDH Name:
BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® GAP FILLER TGF 3500LVO is a 3.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). Its ultra-conformity and low volatility make it the ideal solution for use in medical electronics and other fragile or low-stress assemblies, such as optics and automotive in-cabin electronics. The mixed system provides infinite thickness variations without adding extra stress to components, and will cure at room temperature or faster with the addition of heat.
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Thermal conductivity: 3.5 W/m-K
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100% solids with no additional cure by-products
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Low volatility for outgassing and silicone-sensitive applications
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Ultra-conforming, with excellent wet-out for low-stress interface applications
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For information on our thermal management materials’ UL certifications, please refer to UL file E59150
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, standard viscosity liquids
- Cure type:
- Heat cure
- Flame rating:
- V-0
- Hardener: Color:
- White
- Mixed: Color:
- Light blue
- Operating temperature:
- -60.0 °C - 200.0 °C
- Resin: Color:
- Blue
- Thermal conductivity:
- 3.5 W/mK
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