Part no. (SKU/IDH):
2194122
IDH Name:
BERGQUIST® LIQUI BOND TLB EA1800, 50 ml Dual cartridge
Thermally conductive adhesives
Dispensable liquid for structural component bonding - high strength
This silicone-free, 2-part epoxy liquid is designed for applications where mechanical and chemical stability are needed.
Part no. (SKU/IDH):
2194122
IDH Name:
BERGQUIST® LIQUI BOND TLB EA1800, 50 ml Dual cartridge
Size Please make your selection 50 ml
Packaging type Please make your selection Dual cartridge
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® LIQUI BOND TLB EA1800 is a thermally conductive epoxy liquid adhesive with excellent chemical and mechanical stability. The product cures at room temperature and creates high bond strength, which eliminates the need for fasteners and maintains structural bond even in severe environments. It is ideal for use in filling any surface irregularities between heat sources and heat sinks of similar coefficient of thermal expansion (CTE).
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Thermal conductivity: 1.8 W/m-K
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High bond strength, room temperature cure
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Silicone-free
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Accelerated cure through heat
- Product category:
- Thermally conductive adhesives
Technologies:
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Speciality liquids
- Flame rating:
- V-0
- Hardener: Color:
- Light yellow
- Operating temperature:
- -40.0 °C - 125.0 °C
- Resin: Color:
- Gray
- Thermal conductivity:
- 1.8 W/mK
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