Part no. (SKU/IDH):
2165498
IDH Name:
BERGQUIST GAP PAD TGP 2200SF
Thermal GAP PAD Materials
Green, silicone-free, thermally conductive pad
This green, silicone-free gap-filling polymer is designed for silicone-sensitive applications.
Part no. (SKU/IDH):
2165498
IDH Name:
BERGQUIST GAP PAD TGP 2200SF
Packaging type Please make your selection Other pack. types, not spec.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® GAP PAD® TGP 2200SF is a thermally conductive, electrically isolating polymer, ideal for silicone-sensitive applications with uneven topologies and high stack-up tolerances, typically digital disk drives and fiber optics modules. It is reinforced with fiberglass for easy material handling and added durability during assembly. It has reduced tack on one side, allowing for burn-in processes and easy rework.
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Silicone-free
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Service/operating temperature: -60°C to 125°C (-76°F to 257°F)
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Electrically isolating
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Thermal conductivity: 2.0 W/m-K
- Product category:
- Thermal GAP PAD Materials
Technologies:
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Gap pads
- Color:
- Green
- Operating temperature:
- -60.0 °C - 125.0 °C
- Resin: Carrier type:
- Fiberglass
- Shelf life:
- 12.0 mo
- Standard thickness:
- 0.254 mm - 3.175 mm
- Storage temperature:
- 25.0 °C
- Thermal conductivity:
- 2.0 W/mK
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