Part no. (SKU/IDH):
2711513
IDH Name:
BERGQUIST® GAP FILLER TGF 4500CVO, 50 ml Dual cartridge
Thermal gap fillers
Dispensable liquid with controlled outgassing
This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers controlled volatile outgassing for silicone sensitive applications.
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BERGQUIST® GAP FILLER TGF 4500CVO, 50 ml Dual cartridge fr_CABERGQUIST GAP FILLER TGF 4500CVO PTB (2711586)IDH: 2711513
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BERGQUIST® GAP FILLER TGF 4500CVO, 50 ml Dual cartridge fr_CABERGQUIST GAP FILLER TGF 4500CVO PTA (2711585)IDH: 2711513
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BERGQUIST® GAP FILLER TGF 4500CVO, 50 ml Dual cartridge en_GLBERGQUIST GAP FILLER TGF 4500CVO PTA (2711585)IDH: 2711513
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BERGQUIST® GAP FILLER TGF 4500CVO, 50 ml Dual cartridge en_GLBERGQUIST GAP FILLER TGF 4500CVO PTB (2711586)IDH: 2711513
Marketing materials
Part no. (SKU/IDH):
2711513
IDH Name:
BERGQUIST® GAP FILLER TGF 4500CVO, 50 ml Dual cartridge
Size Please make your selection 50 ml
Packaging type Please make your selection Dual cartridge
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® GAP FILLER TGF 4500CVO is a 4.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It offers infinite thickness variation without causing additional stress to components, and the formula ensures optimal viscosity for efficient automated dispensing processes. This product is curable at room temperature, but the cure rate can be accelerated by applying heat.
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Thermal conductivity: 4.5 W/mK
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Extended working time for manufacturing flexibility
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Controlled volatile silicones
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High dispensing rate
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Thermal gap fillers
Technologies:
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Standard viscosity liquids
- Cure type:
- Heat cure; Room temperature (ambient) cure
- Operating temperature:
- -60.0 °C - 200.0 °C
- Shelf life, @ 25.0 °C:
- 180.0 day
- Thermal conductivity:
- 4.5 W/mK
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