Part no. (SKU/IDH):
2168254
IDH Name:
BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge
Thermal gap fillers
High-performance dispensable liquid with low outgassing
This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers low volatile outgassing for silicone sensitive applications.
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge en_GLBERGQUIST GAP FILLER TGF 3500LVO PTA known as GF3500LV-00-240 Part A (2309700)IDH: 2168254
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge en_GLBERGQUIST GAP FILLER TGF 3500LVO PTB known as GF3500LV-00-240 Part B (2309701)IDH: 2168254
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge fr_CABERGQUIST GAP FILLER TGF 3500LVO PTA known as GF3500LV-00-240 Part A (2309700)IDH: 2168254
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge en_GLBERGQUIST GAP FILLER TGF 3500LVO PTA known as GF3500LV-00-240 Part A (2309700)IDH: 2168254
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge fr_CABERGQUIST GAP FILLER TGF 3500LVO PTB known as GF3500LV-00-240 Part B (2309701)IDH: 2168254
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BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge en_GLBERGQUIST GAP FILLER TGF 3500LVO PTB known as GF3500LV-00-240 Part B (2309701)IDH: 2168254
Part no. (SKU/IDH):
2168254
IDH Name:
BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge
Size Please make your selection 50 ml
Packaging type Please make your selection Dual cartridge
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® GAP FILLER TGF 3500LVO is a 3.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). Its ultra-conformity and low volatility make it the ideal solution for use in medical electronics and other fragile or low stress assemblies, such as optics and automotive in-cabin electronics. The mixed system provides infinite thickness variations without adding extra stress to components, and will cure at room temperature or faster with the addition of heat.
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Thermal conductivity: 3.5 W/m-K
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100% solids with no additional cure by-products
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Low volatility for outgassing and silicone sensitive applications
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Ultra-conforming, with excellent wet-out for low stress interface applications
- Product category:
- Thermal gap fillers
Technologies:
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Standard viscosity liquids
- Cure type:
- Heat cure
- Flame rating:
- V-0
- Hardener: Color:
- White
- Mixed: Color:
- Light blue
- Operating temperature:
- -60.0 °C - 200.0 °C
- Resin: Color:
- Blue
- Thermal conductivity:
- 3.5 W/mK
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