Part no. (SKU/IDH):
3027232
IDH Name:
BERGQUIST® GAP FILLER TGF 2030APS, Barrel/drum
Thermal gap fillers
Silicone-free, stick-on Gap Filler for high throughput assembly applications
This silicone free, 2-part stick-on Gap Filler is perfect for use in high throughput assembly applications requiring medium range thermal transfer and low compressive stress.
Marketing materials
Part no. (SKU/IDH):
3027232
IDH Name:
BERGQUIST® GAP FILLER TGF 2030APS, Barrel/drum
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® GAP FILLER TGF 2030APS is a silicone free, 2-part room temperature curable, stick-on Gap Filler suitable for use in high throughput assembly applications. With a 1.7 W/m-K thermal conductivity, UL94 V-0 flammability rating and a storage stability of 6 months, it provides an excellent solution critical to power storage applications using lithium ion batteries. Ideal for use in automotive power storage, battery designs requiring adhesive strength and high elongation and applications requiring medium thermal transfer and low compressive stress.
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Lap shear strength: 0.7MPa
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High elongation at break: 70%
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Very high dispense rate: >40cc/second
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2-part - easy mixing ratio 1:1
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Silicone-free
- Product category:
- Thermal gap fillers
Technologies:
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High volume liquids
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