Part no. (SKU/IDH):
2190652
IDH Name:
BERGQUIST® GAP FILLER TGF 1500, Dual cartridge
Thermal gap fillers
Versatile, cost-effective dispensable liquid
This thermally-conductive liquid gap filler is designed for easy, precision dispensing, low stress assembly, and low volatile outgassing for silicone sensitive applications.
-
BERGQUIST® GAP FILLER TGF 1500, Dual cartridge fr_CABERGQUIST GAP FILLER TGF 1500 P (2500532)IDH: 2190652
-
BERGQUIST® GAP FILLER TGF 1500, Dual cartridge en_GLBERGQUIST GAP FILLER TGF 1500 P (2500533)IDH: 2190652
-
BERGQUIST® GAP FILLER TGF 1500, Dual cartridge fr_CABERGQUIST GAP FILLER TGF 1500 P (2500533)IDH: 2190652
-
BERGQUIST® GAP FILLER TGF 1500, Dual cartridge en_GLBERGQUIST GAP FILLER TGF 1500 P (2500532)IDH: 2190652
Part no. (SKU/IDH):
2190652
IDH Name:
BERGQUIST® GAP FILLER TGF 1500, Dual cartridge
Component part Please make your selection
Size Please make your selection
Packaging type Please make your selection Dual cartridge
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
- Description
- Technical specification
BERGQUIST GAP FILLER TGF 1500 is a 2-part, high performance, thermally conductive liquid gap filler featuring superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing. The mixed system will cure at room temperature, or faster with the addition of heat. Unlike cured thermal pad materials, a liquid offers infinite thickness variations with little or no stress to the sensitive components during assembly. You can also expect low level natural tack. Once cured, this product provides a soft, thermally conductive, form-in-place elastomer ideal for fragile assemblies and filling unique and intricate air voids and gaps.
-
Thermal conductivity: 1.8 W/m-K
-
Optimized shear thinning characteristics for easy dispensing
-
Excellent slump resistance (stays in place)
-
Excellent wet-out for low stress interface applications
-
Excellent low and high temperature stability
-
For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Thermal gap fillers
Technologies:
-
Standard viscosity liquids
-
Gap pads
- Cure type:
- Heat cure
- Flame rating:
- V-0
- Hardener: Color:
- White
- Mixed: Color:
- Yellow
- Operating temperature:
- -60.0 °C - 200.0 °C
- Resin: Color:
- Yellow
- Thermal conductivity:
- 1.8 W/mK
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
