Part no. (SKU/IDH):
2955707
IDH Name:
TECHNOMELT® PA 6370, Black, Sack
Hot melt adhesives
Low-viscosity low-pressure molding material
This 1-part low-pressure molding material's low-melt viscosity enables small gap filling for protection of fragile electronic components without damage.
Part no. (SKU/IDH):
2955707
IDH Name:
TECHNOMELT® PA 6370, Black, Sack
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
- Description
- Technical specification
TECHNOMELT® PA 6370 is a low-viscosity low-pressure molding material, which can fill gaps as small as 0.5 mm (0.0217"). Once applied, it solidifies to form a barrier between electronics and the environment. It is a resilient encapsulant with good resistance to moisture, heat, and corrosive environments. Ideal for sealing and protecting electrical components such as fan motors, eV charging piles, sensors and many industry devices under harsh conditions. It is a versatile adhesive for many substrates, including FR4 and many plastics including ABS and PC, and its efficient processing, excellent water resistance, good dielectric strength, and flammability rating provide a high-throughput, low energy, sustainable alternative to traditional potting.
-
Low-viscosity, small gap filling (0.5 mm / 0.0217")
-
Easy moldability
-
Strong adhesion to FR4, ABS, PC and other electronic plastics
-
Excellent self-extinguishing properties
-
Excellent hydrophobicity
-
UL 94 V-0 rated
- Product category:
- Hot melt adhesives
Technologies:
-
Polyamide
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
