Part no. (SKU/IDH):
1401362
IDH Name:
LOCTITE® ECCOBOND F 112
Electrically non-conductive adhesives
Electrically non-conductive adhesive for fiber optic assembly applications
This low viscosity, 2-part, non-conductive adhesive is specially formulated for fiber optic assembly applications. It is resistant to both thermal shock and impact.
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LOCTITE® ECCOBOND F 112 en_GLLOCTITE ECCOBOND F 112 MINIPAX (3056824)IDH: 1401362
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LOCTITE® ECCOBOND F 112 en_GLLOCTITE ECCOBOND F 112-H known as TRA-BOND F112-H (1446134)IDH: 1401362
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LOCTITE® ECCOBOND F 112 en_GLLOCTITE ECCOBOND F 112 MINIPAX (3056825)IDH: 1401362
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LOCTITE® ECCOBOND F 112 en_GLIDH: 1401362
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LOCTITE® ECCOBOND F 112 en_GLLOCTITE ECCOBOND F 112-R known as TRA-BOND F112-R (1446136)IDH: 1401362
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LOCTITE® ECCOBOND F 112 fr_CALOCTITE ECCOBOND F 112 MINIPAX (3056824)IDH: 1401362
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LOCTITE® ECCOBOND F 112 fr_CALOCTITE ECCOBOND F 112-H known as TRA-BOND F112-H (1446134)IDH: 1401362
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LOCTITE® ECCOBOND F 112 en_GLLOCTITE ECCOBOND F 112 MINIPAX (3056825)IDH: 1401362
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LOCTITE® ECCOBOND F 112 fr_CALOCTITE ECCOBOND F 112 MINIPAX (3056825)IDH: 1401362
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LOCTITE® ECCOBOND F 112 fr_CALOCTITE ECCOBOND F 112-R known as TRA-BOND F112-R (1446136)IDH: 1401362
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LOCTITE® ECCOBOND F 112 en_GLLOCTITE ECCOBOND F 112-R known as TRA-BOND F112-R (1446136)IDH: 1401362
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LOCTITE® ECCOBOND F 112 en_GLLOCTITE ECCOBOND F 112-H known as TRA-BOND F112-H (1446134)IDH: 1401362
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LOCTITE® ECCOBOND F 112 en_GLLOCTITE ECCOBOND F 112 MINIPAX (3056824)IDH: 1401362
Part no. (SKU/IDH):
1401362
IDH Name:
LOCTITE® ECCOBOND F 112
Packaging type Please make your selection Any kind of pack., incl. bulk
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ECCOBOND F 112 is a 2-part, low viscosity, electrically non-conductive adhesive for fiber optic assembly applications. It is thermal shock and impact resistant, and offers low stress connections with no pistoning. It’s also ideal for multimode and single mode connectors, and small potting and sealing applications.
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2-part: mixing required
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Low viscosity
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Thermal shock and impact resistant
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Low stress connections with no pistoning
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Electrically non-conductive
- Product category:
- Electrically non-conductive adhesives
Technologies:
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Electronics assembly materials
- Cure schedule, @ 25.0 °C:
- 1.0 h
- Cure type:
- Heat cure
- Number of components:
- 2 part
- Shear strength, Aluminum:
- 3000.0 psi
- Storage temperature:
- 27.0 °C
- Thixotropic index:
- 1.0
- Viscosity, @ 25.0 °C:
- 1800.0 mPa·s (cP)
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