Part no. (SKU/IDH):
397716
IDH Name:
LOCTITE® ECCOBOND FP4651, 30 ml Syringe
Fill encapsulants
Epoxy encapsulant for fine wire pitch and cavity-fill applications
This low-viscosity epoxy encapsulant features very low thermal expansion while retaining syringe dispense capabilities for fine wire pitch and cavity-fill applications.
Part no. (SKU/IDH):
397716
IDH Name:
LOCTITE® ECCOBOND FP4651, 30 ml Syringe
Size Please make your selection 30 ml
Packaging type Please make your selection Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ECCOBOND FP4651 epoxy encapsulant features very low thermal expansion while retaining syringe dispense capabilities. Its low viscosity and 50-micron maximum particle size gives it improved handling properties for fine wire pitch and cavity-fill applications. It exhibits excellent chemical resistance and thermal stability.
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Excellent handling properties
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Excellent thermal stability
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Excellent chemical resistance
- Product category:
- Damming materials
Technologies:
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Electronics assembly materials
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