Part no. (SKU/IDH):
2023022
IDH Name:
LOCTITE® ECCOBOND EN 3838T, 36 g Syringe
Encapsulants
Flexible encapsulant for Pb-free applications
A 1-part, thixotropic coating liquid that provides components on PCBs a flexible, low Tg encapsulation material.
Part no. (SKU/IDH):
2023022
IDH Name:
LOCTITE® ECCOBOND EN 3838T, 36 g Syringe
Size Please make your selection 36 g
Packaging type Please make your selection Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ECCOBOND EN 3838T is a black, thixotropic coating liquid for encapsulating components on PCBs. It’s ideal for CSP and BGA package applications, formulated with an epoxy-based resin, and cures fast at moderate temperatures. When cured, it provides physical protection, stable electronic performance, and temperature/humidity/bias testing protection.
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Low modulus
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Highly reworkable
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Fast curing
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Thixotropic for ease of application
- Product category:
- Encapsulants
Technologies:
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Electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 217.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 57.0 ppm/°C
- Cure schedule, @ 130.0 °C:
- 8.0 min
- Cure type:
- Heat cure
- Glass transition temperature (Tg):
- 2.0 °C
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 6700.0 mPa·s (cP)
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