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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Expertise Within

Enabling High-Performance Electronics

Today's electronics systems are expected to perform more reliably than ever before. Anytime. Anywhere. Under any condition. Delivering on that expectation largely depends on the unseen materials that remove heat, defend against harsh conditions, and bond without fail. And that takes the know-how of a trusted partner engineering multi-material solutions to provide holistic Expertise Within.

The Future Runs on Electronics

Scaling AI Compute

27% CAGR

AI infrastructure spending by 2030.

AI is accelerating demand for high-performance computing, networking, power delivery, and thermal management solutions.1

Accelerating Electrification

30% Growth

Power Electronics Market by 2030.

Growth is driven by EVs, renewable energy, smart grids, and industrial automation.2

Power Density on the Rise

12x Power

From 5-10 kW to 60+ kW per AI rack

AI is redefining power and thermal requirements across electronics.3

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Proven Expertise

Higher electronics demand is driving the need for high power, high functionality, high reliability, and miniaturization.

Complex challenges require a trusted partner. For decades, Henkel’s advanced materials expertise and trusted LOCTITE, BERGQUIST, AND TECHNOMELT brands have delivered.

We help to solve the diverse challenges electronics designers/manufacturers face and provide: 

  • Reliability at the extreme ends of operating temperature, environment, and use.  
  • Long lifecycles for electronics that require enduring performance.  
  • Efficiency on the line and in the field. 

Keep it Cool:

Thermal Management

Electronic systems and PCBs are only getting more powerful, compact, and capable. Which means they are also getting hotter – and heat is the enemy of performance. Henkel knows how to control the thermal load. Our thermal interface materials are formulated for today’s most complex electronic assemblies – no matter the thermal design power. 

Keep it Shielded: Electronics Protection Solutions

Over, under, and all around. Protecting electronic assemblies from chemicals, moisture, dust, temperature extremes, and mechanical stress is what Henkel encapsulants, underfills, potting compounds, conformal coatings, and low-pressure molding materials do. Our materials help keep electronics systems protected and reliable so that they can keep working as intended.

Keep it Together: Electronics Bonding Solutions

Strong bonds ensure strong performance. Henkel’s legacy of adhesive formulation expertise spans over a century. For electronics, that means vibration, shock, temperature extremes, and mechanical stress are no match for the proven strength of our adhesives. Electronic assemblies can be confidently deployed with the assurance they are built tough to stay reliable.

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