Part no. (SKU/IDH):
2165498
IDH Name:
BERGQUIST GAP PAD TGP 2200SF
Thermal GAP PAD materials
Green, silicone-free, thermally conductive pad
This green, silicone-free gap-filling polymer is designed for silicone-sensitive applications.
Part no. (SKU/IDH):
2165498
IDH Name:
BERGQUIST GAP PAD TGP 2200SF
Packaging type Please make your selection Other pack. types, not spec.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® GAP PAD® TGP 2200SF is a thermally conductive, electrically isolating polymer, ideal for silicone-sensitive applications with uneven topologies and high stack-up tolerances, typically digital disk drives and fibre optics modules. It is reinforced with fibreglass for easy material-handling and added durability during assembly. It has reduced tack on one side, allowing for burn-in processes and easy rework.
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Silicone-free
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Service/operating temperature: -60°C to 125°C (-76°F to 257°F)
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Electrically isolating
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Thermal conductivity: 2.0 W/m-K
- Product category:
- Thermal GAP PAD materials
Technologies:
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Gap pads [GAP PAD]
- Colour:
- Green
- Operating temperature:
- -60.0 °C - 125.0 °C
- Resin: Carrier type:
- Glass Fibre
- Shelf life:
- 12.0 mo
- Standard thickness:
- 0.254 mm - 3.175 mm
- Storage temperature:
- 25.0 °C
- Thermal conductivity:
- 2.0 W/mK
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