Case study
Learn how the manufacturer of an AC/DC power supply leveraged a robust thermal management solution for its compact design.
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The customer's new AC/DC power supply for cloud and hyperscale data centres required a robust thermal management solution for its compact design.
Different substrate surface topographies across the device dictated an adaptable material that could accommodate dimensional variations to maximise thermal transfer.
It also had to secure parts, dissipate heat and reduce mechanical stress while working within the space constraints of the new design.
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Improved productivity and output rates by 20 to 30% -
Improved overall total manufacturing cost by 15 to 20% -
Streamlined inventory and reduced supply complexity, translating to 15 to 30% additional opportunity cost for the customer's system -
Ensured minimal device stress -
Secured reliability by delivering a more compact power solution
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