Documento técnico
Henkel's complete portolfio of conductive die attach film materials capability spans a broad spectrum of package type - laminated packages, die sizes and cost/performance ratios.
Henkel’s cDAF material development has centered on solutions for leadframe packages – and to overwhelming market acceptance. Henkel now brings the unmatched benefits of cDAF to manufacturers of laminate-based devices by introducting LOCTITE ABLESTIK CDF 600P to the market.
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